As AI, HPC, and high-density computing workloads become the norm in data centers, cooling is no longer a “supporting system,” but a core piece of infrastructure that directly affects compute performance, energy efficiency, and long-term operational costs. Against this backdrop, Direct-to-Chip (D2C) liquid cooling is moving from niche deployments to large-scale adoption and has become one of the most engineering-viable liquid cooling technologies available today. Compared with traditional air-based cooling, D2C delivers more efficient and controllable thermal management by bringing coolant directly to the heat source.

What Is Direct-to-Chip Cooling?

Direct-to-Chip Cooling is a liquid cooling technology built on the principle of delivering coolant directly to the surfaces of high-heat-density components inside a server. These components typically include CPUs, GPUs, accelerator cards, memory modules, and power modules. Through direct contact between a cold plate and the chip package, heat is rapidly transferred into the liquid and carried away, eliminating reliance on air as the primary heat transfer medium.

This approach avoids multi-stage heat transfer paths (chip → heat sink → air → air conditioning system), significantly improving cooling efficiency and enabling server designs with higher power density.

How Does Direct-to-Chip Cooling Work?

In a D2C system, a customized cold plate is installed on top of each critical heat-generating component. Precision microchannels are engineered inside the cold plate. Coolant flows from rack-level distribution manifolds into the server, passes through the cold plates to absorb heat from the chips, and then returns at a higher temperature to a secondary cooling loop.

The overall system is typically structured across three layers:

• Server-level loop: cold plates, flexible hoses, quick connectors

• Rack-level loop: supply and return manifolds, leak detection

• Facility-level loop: CDU (Coolant Distribution Unit), heat exchangers, chilled water or dry cooling systems

This layered architecture allows liquid cooling to be deployed without completely overhauling existing data center cooling infrastructure, while maintaining high levels of operational safety and serviceability.

What Are the Different Types of Direct Cooling Technology?

Within Direct-to-Chip liquid cooling, the most common technical distinction is between single-phase and two-phase systems. The key difference lies not in which is “more advanced,” but in the trade-off between heat transfer mechanisms and system complexity.

Single-Phase Direct-to-Chip Cooling

In a single-phase system, the coolant remains in liquid form throughout the entire circulation loop. Heat is removed by raising the temperature of the liquid, resulting in stable and predictable system behavior.

From an engineering perspective, the advantages of single-phase D2C include strong alignment with traditional chilled-water systems, clear design and operational logic, and relatively relaxed requirements for pressure control and sealing. These characteristics make it easier to integrate with existing data center infrastructure, which is why single-phase D2C is currently the most mature and widely deployed solution at scale.

Two-Phase Direct-to-Chip Cooling

Two-phase systems leverage the phase change of the coolant within the cold plate to absorb a large amount of latent heat, enabling higher heat transfer capacity at lower flow rates.

While this approach offers clear thermal efficiency advantages, it is also more sensitive in system design. Pressure fluctuations caused by phase change, fluid management, and long-term reliability considerations increase engineering complexity. As a result, two-phase D2C is currently used primarily in specialized scenarios with extreme heat density requirements rather than in general-purpose deployments.

In simple terms:
Single-phase systems emphasize stability and scalability, while two-phase systems focus on maximum heat transfer capability. Neither is inherently superior; each is suited to different engineering objectives.

7 Advantages of Direct-to-Chip Liquid Cooling

The value of Direct-to-Chip liquid cooling is not just about “cooling faster,” but about fundamentally changing how thermal management is achieved.

Shorter Heat Transfer Path

In a D2C architecture, heat is removed almost immediately at the point of generation, reducing intermediate media and transfer layers. This improves overall cooling efficiency and enables faster, more direct temperature control.

More Stable Performance Output

For high-performance computing workloads, sustained and stable cooling is often more important than peak cooling capacity. D2C maintains chips within a stable thermal envelope under continuous high load, reducing thermal throttling and making performance more predictable.

Reduced Dependence on Airflow Systems

By shifting the primary cooling task to liquid, reliance on high-volume, high-pressure airflow is significantly reduced. This lowers fan power consumption and provides greater flexibility in data hall layout and noise control.

Headroom for Future Density Growth

As chip power continues to rise, D2C offers a scaling path that does not require proportional expansion of air-cooling infrastructure, allowing data centers to support higher compute density within existing physical space.

Greater Thermal Design Freedom

By bringing cooling capability into the server itself, D2C reduces dependence on room-level airflow constraints. This enables more flexible hardware designs, such as denser board layouts and higher-power accelerator configurations, without constant compromises driven by airflow limitations.

Improved Thermal Consistency

In air-cooled environments, temperature variation between servers and racks is common, often leading to localized hot spots. By acting directly on heat sources, D2C significantly reduces this unevenness, resulting in more consistent operating conditions across large server fleets—an important factor for large-scale parallel computing.

Lower Long-Term Operational Uncertainty

As server power increases, air-cooling systems often require continuous tuning or expansion. D2C provides a more stable thermal management path, making energy efficiency and cooling capacity more predictable over the coming years and reducing the likelihood of repeated infrastructure retrofits.

8 Considerations for Implementing a Direct Liquid Cooling System

In real-world deployments, the challenges of D2C are more often related to system integration than to the technology itself.

1. Choosing the Deployment Scope
   Not every rack requires liquid cooling. A common and practical approach is to prioritize D2C for high-heat-density servers while running it alongside air cooling, delivering clear benefits while managing risk.

2. Cooling Infrastructure Compatibility
   Existing cooling sources must be evaluated for their ability to support liquid cooling loops, including water quality, redundancy, and operating temperature ranges. This step often determines long-term system stability.

3. Operational Model Adjustments
   Liquid cooling does not increase operational complexity, but it does shift operational focus. Flow rate, temperature differential, and connector status replace some traditional air-cooling metrics as key monitoring parameters.

4. System-Level Coordination
   One of the true challenges lies in integrating liquid cooling with existing cooling supply, monitoring, and energy management systems. This requires holistic planning during the design phase rather than reactive fixes later.

5. Standardization and Supply Chain Coordination
   Liquid cooling involves multiple components—servers, cold plates, quick connectors, and CDUs. The level of standardization directly affects future scalability and maintenance. Choosing solutions based on mainstream interfaces and modular design helps reduce supply chain dependency risks.

6. Redundancy and Fault Isolation Design
   Like any critical infrastructure, liquid cooling systems require clear redundancy strategies. At the CDU, pump, and critical valve levels in particular, designs should ensure that single points of failure do not impact entire racks or rows of servers.

7. Monitoring and Data Visualization
   Liquid cooling systems should not become a “black box.” Real-time monitoring of flow, supply/return temperature differentials, and pressure changes enables early detection of issues before they affect workloads—especially important in high-density environments.

8. Staff Training and Operational Process Updates
   Even with mature system design, personnel understanding of liquid cooling directly impacts operational safety. Clear operating procedures, emergency response workflows, and foundational training are essential for long-term stable operation.

FAQ

Will Direct-to-Chip cooling completely replace air cooling?
No. The prevailing approach today is coexistence, with liquid cooling and air cooling handling different thermal loads.

Is D2C suitable for retrofit data centers?
Yes. Compared with immersion cooling, D2C is better suited for phased deployment in existing data centers.

How reliable are liquid cooling systems?
Mature D2C systems incorporate redundancy and leak detection, and their overall reliability has been validated through large-scale deployments.

Direct Liquid Cooling Data Center Services from ATTOM

ATTOM provides end-to-end Direct-to-Chip liquid cooling support for data centers, covering planning, deployment, and operations. From rack-level liquid cooling architecture design, CDU integration, and standardized piping and interfaces to seamless integration with existing cooling systems, ATTOM’s solutions are built around practical engineering execution, helping operators introduce liquid cooling while keeping risk under control.

Whether building new high-density AI data centers or progressively upgrading existing facilities, ATTOM is committed to delivering flexible, reliable, and scalable Direct-to-Chip liquid cooling solutions—helping customers achieve long-term balance across compute performance, energy efficiency, and sustainability.