Definition
Direct-to-Chip Cooling (D2C) is a liquid cooling technology that removes heat by circulating coolant through cold plates attached directly to high-heat-generating components, such as CPUs and GPUs.
Unlike traditional air cooling, which transfers heat from IT equipment into surrounding air, direct-to-chip cooling transfers heat directly from the component into a liquid coolant.
D2C cooling is widely used for high-density computing, including AI and HPC infrastructure.
For a deeper explanation of how direct-to-chip liquid cooling works, its key components, applications, and role in high-density computing, see ATTOM’s Direct-to-Chip Liquid Cooling guide.
How Direct-to-Chip Cooling Works
A typical direct-to-chip cooling system follows a closed liquid cooling loop:
- Coolant is supplied to the server through a distribution system.
- The coolant flows through cold plates attached to high-power components.
- Heat transfers from the components into the coolant.
- Heated coolant returns to the cooling distribution system.
- A Coolant Distribution Unit (CDU) and heat exchanger transfer the heat to the facility cooling system.
The main components may include cold plates, manifolds, tubing, CDUs, heat exchangers, and monitoring systems.
Direct-to-Chip Cooling for AI Data Centers
D2C cooling is particularly useful for AI and HPC environments where high-power processors generate heat loads that can challenge conventional air cooling.
By bringing liquid closer to the heat source, D2C cooling can support higher rack densities while reducing dependence on large volumes of airflow.
D2C systems can also operate alongside air cooling. In hybrid architectures, liquid cooling handles high-density components while air cooling manages other IT equipment and residual room heat.
Direct-to-Chip vs. Other Cooling Technologies
| Technology | Primary Heat Removal Method |
|---|---|
| Air Cooling | Heat transferred from IT equipment to air |
| Direct-to-Chip Cooling | Liquid flows through cold plates attached to components |
| Immersion Cooling | IT equipment is immersed in dielectric fluid |
Direct-to-chip cooling and immersion cooling are both forms of liquid cooling, but they use different approaches to transfer heat from IT equipment.
Related Terms
- Liquid Cooling
- Rear Door Heat Exchanger (RDHx)
- Coolant Distribution Unit (CDU)
- Manifold
- Immersion Cooling
- Air Cooling
- Thermal Management
- AI Data Center
- High-Density Computing
Related ATTOM Solutions
ATTOM provides direct-to-chip liquid cooling solutions for high-density AI and computing environments, including cooling infrastructure for GPU-based systems.
Explore ATTOM’s Direct-to-Chip Liquid Cooling solutions for AI servers and high-density data center deployments.
