Definition
Immersion Cooling is a liquid cooling technology in which servers or IT components are immersed directly in a non-conductive dielectric cooling fluid to remove heat.
Unlike air cooling, which transfers heat through air, immersion cooling transfers heat directly from IT equipment into the surrounding liquid. This makes it suitable for high-density computing, AI, GPU, and HPC environments.
For a deeper explanation of immersion cooling technologies, advantages, and deployment considerations, see ATTOM’s Immersion Cooling for Data Center: Advantages and Deployment →
How Immersion Cooling Works
In a typical immersion cooling system:
- IT equipment operates while submerged in dielectric coolant.
- Heat generated by processors and other components transfers directly into the fluid.
- Heated coolant is circulated through a heat exchanger or cooling system.
- The heat is transferred to a facility cooling loop or heat rejection system.
- Cooled fluid returns to the immersion tank for continued operation.
Because the cooling fluid directly surrounds the IT equipment, immersion cooling significantly reduces reliance on conventional airflow management.
Types of Immersion Cooling
Single-Phase Immersion Cooling
The dielectric coolant remains in liquid form during operation. Heated coolant is circulated through a heat exchanger and returned to the immersion system after cooling.
Two-Phase Immersion Cooling
The dielectric coolant changes from liquid to vapor as it absorbs heat. The vapor then condenses back into liquid, creating a continuous heat-transfer cycle.
The two approaches differ in system architecture, fluid management, and operational requirements.
Immersion Cooling for High-Density Computing
Immersion cooling is particularly relevant to:
- AI and GPU infrastructure
- High-performance computing
- High-density server deployments
- Specialized computing environments
By transferring heat directly into liquid, immersion cooling can support high thermal loads while reducing dependence on fans, airflow paths, and room-level cooling infrastructure.
However, deployment also requires consideration of hardware compatibility, coolant management, maintenance procedures, and facility integration.
Immersion Cooling vs. Direct-to-Chip Cooling
Both technologies use liquid to remove heat from IT equipment, but they use different approaches.
| Technology | Heat Transfer Approach |
|---|---|
| Direct-to-Chip Cooling | Coolant flows through cold plates attached to high-power components |
| Immersion Cooling | IT equipment is immersed directly in dielectric coolant |
Direct-to-chip cooling targets specific high-heat components, while immersion cooling surrounds the compatible IT equipment with cooling fluid.
Related Terms
- Liquid Cooling
- Direct-to-Chip Cooling
- High-Density Computing
- AI Data Center
- Thermal Management
- Rear Door Heat Exchanger (RDHx)
- Coolant Distribution Unit (CDU)
- Rear Door Heat Exchanger
Related ATTOM Solutions
ATTOM’s OceanCool immersion cooling solutions are designed for high-density AI and computing environments requiring direct liquid-based heat removal and advanced thermal management.
